Power semiconductor technologies covering switching devices, control, protection and package architectures.
The supplied technical PDFs add a detailed semiconductor layer to the customer-approved portfolio. The material covers high-, medium- and low-voltage MOSFET technologies, including SGT and Trench approaches, and package families such as TOLL, TOLG, TOLT, TO263-7, sTOLL and LFPAK.
The technical material includes documented device examples across approximately 30 V to 250 V classes, with individual devices carrying their own specified RDS(on), current capability and package characteristics. These figures should be treated as device-specific specifications rather than blanket claims for the entire portfolio.
TOLL, TOLG and TOLT represent different mechanical and thermal approaches. The design choice should consider board footprint, power density, thermal path, soldering and inspection, mechanical robustness and application requirements.
The LFPAK material describes ultra-low internal resistance, copper-clip construction, high thermal performance, a small footprint, high power density and high-current capability. The supplied document identifies a 40 V product example with internal resistance as low as 0.5 mΩ and product examples reaching 300 A under their stated conditions.